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Bbu

The meaning of «bbu»

Bbuddha... Hoga Terra Baap (English: Your dad must be old) is a 2011 Bollywood action comedy film directed by Puri Jagannath being his second Hindi film after Shart: The Challenge.
BBurago is an Italian model car manufacturer, that was based in Burago di Molgora, Italy, which made mostly diecast cars from 1976 to 2005. At its most popular, Bburago's main competition were Politoys and Maisto the latter of which was to become dominant in the 1:18 market segment around 2000. Showing Maisto's influence in this market, since 2007 Bburago has been a brand under that group.
BBU is an American hip hop group from Chicago, Illinois, consisting of Jasson Perez, Richard "Epic" Wallace, and Michael "Illekt" Milam.
Big Brother is a television reality game show based on an originally Dutch TV series of the same name created by producer John de Mol in 1997. The series follows a group of contestants, known as HouseGuests, who are living together in a custom-built home under constant surveillance.
Big Brother is the British version of the international reality television franchise Big Brother created by producer John de Mol in 1997. The show follows a number of contestants, known as housemates, who are isolated from the outside world for an extended period of time in a custom built house.
Big Brother 2014, also known as Big Brother 15 and Big Brother: Power Trip, was the fifteenth series of the British reality television series Big Brother, hosted by Emma Willis and narrated by Marcus Bentley.
Big Brother 2013, also known as Big Brother 14 and Big Brother: Secrets and Lies, was the fourteenth series of the British reality television series Big Brother.
BBU may refer to:
A Bachelor of Business (B.Bus, BBus, BBus (Major)) is a three or four year business degree offered by traditional and newer universities from the post-Dawkins era in Australia and New Zealand.
Bumpless Build-up Layer or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires.

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